RFID Tags / RFID Inlay
Inlay sheet for combi card means the prelam (pre-laminating) specially designed for smart card contact and smart card contactless. It supports both contact and contactless communication, and controlled by CPU to switch between contact and contactless working modes. XRFID dual interface card inlay combines reliability, durability and prefect electrical performance together, is compliant with diversified standard
Different sizes, materials, chips are available, and you can personalize it.
24-hour one-on-one service, Fast delivery, and Good packaging.
Features
1, When used in contact mode card comply with ISO/IEC 7816 standard, in contactless mode it meets ISO/IEC 14443 standard.
2, The wire deployed neatly, no wire blotting on the finished card, tidy and pretty appearance.
3, automatic spot welding avoids unstable function, failure and short life time caused by static electricity damage.
4, trimmed reference edges and printed cross marks available to make the further process easier.
5, The shape and size of the antenna can be customized to adapt specific demand, layout and thickness can be customized.
Specifications
Material | Packing: PVC, PET, PET-G, PC | |
Antenna: copper coil, aluminum | ||
Thickness | 0.40mm±0.02mm or customized, minimum thickness: 0.35mm. | |
Layout & size | 5*5 | 305*460mm(popular inside China) |
3*8 | 295*480mm(popular inside China) | |
4*8 | 391*520mm | |
4*10 | ||
5*8 | 495*518mm | |
extra-large size 56(7*8) layout is available, another layout can be customized. | ||
Interface | Contactless and contact | |
Frequency | 13.56MHz, customizable | |
Chip | FM1208, Java card, and other model | |
Antenna Technique: | HF: Aluminum etching, pre-winding copper coil, ultrasonic wire implanting / ultrasonic welding | |
Antenna Size | 520*410mm,490*310mm,470*390mm,600*380mm | |
Technique | Double interface tin slice technology | |
Double interface conductive adhesive technology | ||
Double interface pickline technology | ||
Pack | 50pcs/bag | |
Storage temperature | -25°C ~ +65°C | |
Application
Applied to produce dual interface CPU card.
Product Show
Double interface tin slice technology
Double interface conductive adhesive technology
Double interface pickline technology
Double interface pickline technology
Double interface conductive adhesive technology
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